Alloy Conversion & Re-Tinning Service UK

Q: Can you convert lead-free components to tin/lead for defence use?

Yes. RoHS-compliant lead-free components can be converted to tin/lead (SnPb) alloy to meet the requirements of defence and aerospace assemblies that operate under RoHS exemptions. The process complies with GEIA-STD-0006.

Systemation Euro provides a specialist alloy conversion and re-tinning service for electronic components, operating from our facility in Northampton. We convert lead-free (RoHS) components to tin/lead alloy for use in high-reliability defence, aerospace, medical, and industrial applications. The automated hot solder dip process delivers consistent, repeatable results with full traceability, meeting the requirements of GEIA-STD-0006.

What Is Alloy Conversion & Re-Tinning?

Alloy conversion, also known as re-tinning or robotic hot solder dip, is the process of removing the existing solder finish from electronic component leads and replacing it with a new alloy. This is required when components need to meet the alloy specifications of a high-reliability assembly process, or when stored components need their solderability restored.

RoHS to Tin/Lead Conversion

Lead-free (RoHS) components converted to tin/lead (SnPb) alloy for use in defence, aerospace, medical, and industrial assemblies operating under RoHS exemptions.

Tin/Lead to Lead-Free Conversion

Legacy SnPb components converted to SAC305 or other lead-free alloys for use in commercial production lines requiring full RoHS compliance.

Alloy Refresh

Components that have been in storage and suffered oxidation or alloy degradation can be re-tinned to restore solderability and return them to as-new condition.

Tin Whisker Mitigation

Pure-tin (Sn) finishes are susceptible to tin whisker growth, which can cause short circuits in high-density assemblies. Converting to a tin/lead alloy eliminates this risk entirely.

De-Golding

Gold-plated component leads require removal of the gold finish prior to soldering to prevent gold embrittlement. Our hot solder dip process strips the gold and applies a fresh alloy coating.

Micro Device Re-Tinning

Small passive components including 0402 resistors and capacitors are processed alongside larger devices such as QFP, TSOP, SOIC, and DIP packages within the same automated workflow.

Our Alloy Conversion Process

Our automated alloy conversion process follows a controlled, multi-stage workflow to ensure consistent alloy coverage without exposing devices to excessive heat or time. The process is fully automated, eliminating operator variability and ensuring every component is processed identically within controlled thermal parameters, in compliance with GEIA-STD-0006.

Component receipt and incoming inspection — components are logged, inspected, and loaded into carrier trays prior to processing.
Automated vacuum pick — an automated vacuum tool transports each device from the carrier tray, eliminating manual handling.
Sequential fluxing — each side of the device is fluxed in sequence to prepare the lead surfaces for alloy adhesion.
Pre-heat and temperature verification — the device is pre-heated and temperature checked before dipping to prevent thermal shock.
Dynamic solder wave dip — each side is dipped in the dynamic solder wave in sequence, applying a consistent alloy coating across all leads.
Post-dip cleaning — components are cleaned to IPC standards following the dip process.
Re-bake and vacuum packing — devices are re-baked and vacuum packed with moisture sensitivity desiccant and humidity indicator card.
Full lot traceability documentation — a certificate of conformance is issued for every lot processed, with complete process records available for defence and aerospace programmes.

The process handles a wide range of package types including QFP, TSOP, SOIC, SOP, DIP, and small passive components such as 0402 resistors and capacitors, making it suitable for full bill of material conversion on complex assemblies.

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Alloy Conversion Capabilities

Parameter	Capability
Component types	QFP, TSOP, SOIC, SOP, DIP, small passives including 0402 resistors and capacitors
Alloy conversions supported	SnPb to SAC305, SAC305 to SnPb, Sn to SnPb, alloy refresh of oxidised components
Standards compliance	GEIA-STD-0006, J-STD-001
Post-process cleaning	IPC standard cleaning applied to all processed components
Packing	Vacuum sealed with desiccant and humidity indicator card
Traceability	Full lot documentation and certificate of conformance available on request
Certifications	AS9100 Rev D, ISO 9001:2015 (UKAS accredited), ISO 14001:2015, JOSCAR registered
Location	Northampton, central England — UK and international customers accepted

Why Re-Tinning Is Required in High-Reliability Industries

Since the introduction of RoHS legislation, the majority of electronic components are manufactured with a pure-tin (Sn) or lead-free alloy finish. In high-reliability applications — defence, aerospace, medical, and oil and gas — this creates two significant risks that must be addressed before components enter the assembly process.

Tin Whisker Formation

Pure-tin finishes are susceptible to growing tin whiskers — microscopic metallic filaments that can cause short circuits in densely packed assemblies. This is a well-documented failure mode in defence and aerospace electronics. Converting to a tin/lead alloy eliminates the risk entirely and is the approach mandated by many high-reliability programme specifications.

Process Incompatibility

Many high-reliability assemblies are qualified to use SnPb solder paste. Introducing lead-free components into a tin/lead process creates alloy mixing risks that can compromise solder joint integrity and long-term reliability. Alloy conversion ensures every component on the bill of material is compatible with the assembly process alloy specification.

Gold Embrittlement

Gold-plated component leads must be de-golded prior to soldering. Residual gold dissolves into the solder joint during reflow, forming brittle gold-tin intermetallic compounds that reduce joint strength and fatigue life. Our hot solder dip process removes the gold finish and applies a fresh alloy coating in a single operation.

Oxidation and Storage Degradation

Components held in storage for extended periods can suffer oxidation of the lead finish, reducing solderability and increasing the risk of poor joints during assembly. Re-tinning restores the alloy surface and returns components to a condition suitable for use in production, avoiding costly assembly failures or rework.

RoHS Exemption Compliance

Defence, aerospace, medical, and certain industrial applications operate under RoHS exemptions that permit the use of tin/lead solder. Converting commercially available lead-free components to SnPb alloy allows OEMs and EMS providers to use standard market supply within exempt assemblies without compromising their qualification status.

Bill of Material Conversion

When a full assembly requires alloy conversion, we can process the complete bill of materials — including small passives such as 0402 resistors and capacitors — ensuring every component entering the line meets the same alloy specification. This removes the risk of mixed-alloy joints across the assembly.

Convert, Programme, and Tape and Reel in One Visit

Unlike specialist re-tinning houses, Systemation Euro can combine alloy conversion with component programming and tape and reel packaging in a single workflow at our Northampton facility. This eliminates the need to ship components to multiple suppliers, reducing lead times, handling risk, and the administrative overhead of managing separate purchase orders across the supply chain.

A typical combined workflow looks like this:

Components received at our Northampton facility
Alloy conversion or re-tinning carried out to GEIA-STD-0006
Device programming completed to customer firmware specification
Components taped and reeled to EIA-481-F for direct SMT line-feed
Full lot documentation and COC issued, components returned or delivered direct to line

If you need components converting, programming, and packaging ready for direct line-feed, we can handle the complete process under one roof. Contact us to discuss your requirements or request a quote for a combined service.

Quality and compliance: Systemation Euro holds AS9100 Rev D and ISO 9001:2015 certification audited and accredited by UKAS, and works to ISO 14001:2015 environmental management standards. We are JOSCAR registered, making us a pre-qualified supplier for defence and aerospace procurement programmes across the UK. All alloy conversion and re-tinning services are carried out at our Northampton facility.

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Founded over 30 years ago in 1992.

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FAQ's

Below we have answered some common questions, however if the answer you're looking for isn't here please call us on +44 (0)1604 491107 or email via our contact form.

What is the difference between alloy conversion and re-tinning?

Alloy conversion refers to changing the solder alloy on component leads
from one specification to another. For example, lead-free SAC305 to
tin/lead SnPb. Re-tinning is a broader term that includes alloy
conversion as well as refreshing oxidised or degraded tin finishes to
restore solderability. Both processes use the same automated hot solder
dip method.

Can you convert lead-free components to tin/lead for defence use?

Yes. This is one of the most common requests we receive. RoHS-compliant
lead-free components can be converted to tin/lead (SnPb) alloy to meet
the requirements of defence and aerospace assemblies that operate under
RoHS exemptions. The process complies with GEIA-STD-0006.

Do you re-tin small passive components such as resistors and capacitors?

Yes. Our automated process handles small passive components including
0402 resistors and capacitors, as well as larger devices such as QFP,
TSOP, SOIC, and DIP packages.

Where are you based and do you accept components from across the UK?

We are based in Northampton, in the East Midlands, and accept components
from customers across the UK and internationally. Components can be
shipped to our facility for processing and returned once complete.

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Other Services We Offer

Device Programming

IC programming services, complemented by state-of-the-art device storage and handling.

SMD Taping & Reeling

Our automatic Taping & Reeling machines provide our customers with state-of-the-art class-leading capabilities.

Laser Marking

We use a concentrated beam of light to create permanent marks on the surfaces of target components.

Axial & Radial Taping

We tape and reel a wide range of axial and radial components including capacitors, resistors, diodes and springs.

Lead Pre-forming

Systemation Euro provides an unparalleled pre-forming service, tailored for both active and passive discrete components.

Dry Packing

We offer a full dry packing service for all moisture-sensitive components.

OEM Project Support

Work with experienced operators who have full knowledge of the machines who can quickly have your cell operating.

Consumables Supply

In addition to the extensive services provided by Systemation Euro, we also supply a complete range of consumables.

Schedule a consultation with one of our specialists today to determine the perfect service solution.