BGA Laser Reballing Service UK

BGA Laser Reballing for OEMs and Contract Electronics Manufacturers

Systemation Euro provides BGA laser reballing services for OEMs, distributors, and contract electronics manufacturers across the UK and Europe. Using precision laser technology, we remove and replace solder balls on Ball Grid Array (BGA) packages without reflow cycles, preserving component integrity and extending service life.

Our laser reballing service is available as a standalone service or combined with our IC programming, tape and reel, and dry packing services for a complete component finishing solution.

BGA laser reballing pairs well with our IC programming and laser marking services, and we also offer alloy conversion and re-tinning for components requiring a different finish, with counterfeit and authenticity testing available before any rework begins.

Our BGA Laser Reballing Capabilities

Systemation Euro's BGA laser reballing service handles fine-pitch BGA, CSP and flip-chip packages down to 0.4mm ball pitch, with rework carried out to IPC-7711/7721 standards.

BGA Package Types

Full BGA, micro-BGA, CSP, flip-chip, and LGA components handled with precision tooling.

Alloy Options

Lead-free (SAC305) and leaded (SnPb) solder ball replacement available to customer specification.

Ball Pitch Range

Capable of handling fine-pitch BGA down to 0.4mm. Suitable for high-density PCB assemblies.

IPC-7711/7721 Rework

All reballing carried out in accordance with IPC-7711/7721 rework and repair standards.

Traceability

Full lot traceability and documentation provided, essential for aerospace, defence, and medical programmes.

UK-Based Service

Based in Northampton, UK. Fast turnaround with Europe-wide shipping available on request.

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Customer Enquiries

01604 491107

info@systemationeuro.com

About Our BGA Laser Reballing Process

BGA reballing is the process of removing worn, damaged or incorrect solder balls from a ball grid array package and replacing them with new ones to a precise specification. It is used across component recovery, alloy conversion from lead-free to leaded, and obsolescence management where sourcing a replacement device is not viable.

Systemation Euro uses laser-assisted reballing to remove existing solder balls cleanly without thermal stress to the package substrate. New balls are placed and reflowed under controlled conditions to meet the original or converted alloy specification. Every reballed component is inspected and documented before despatch, giving customers full confidence in the integrity of the reworked device.

Typical applications include: component recovery after PCB rework, SnPb to SAC305 alloy conversion for RoHS compliance, reverse conversion for defence and aerospace programmes requiring leaded solder, and BGA salvage from end-of-life or obsolete boards.

Quality and Compliance for BGA Rework

Systemation Euro is certified to ISO 9001:2015, audited and accredited by UKAS. We are working towards AS9100 Rev D and JOSCAR accreditation, and operate to ISO 14001:2015 environmental management standards. All BGA laser reballing and rework services are carried out at our Northampton facility.

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Laser Process

BGA and chip-scale packages reballed using a controlled laser process, providing consistent, repeatable results without the variation of manual re-balling.

Alloy Flexibility

Reballing available in lead-free, tin-lead, and other alloy specifications to match your board assembly requirements.

Quality Assurance

All reballed components inspected before despatch. Operated within our ISO 9001:2015 UKAS-accredited quality management system. Working towards AS9100 Rev D.

Full Traceability

Incoming component records, process parameters, and inspection results maintained for every batch. Documentation available on request.

Package Range

Reballing carried out on BGA packages from micro-BGA through to large area array devices. Contact us to confirm suitability for your component.

Same-Site Processing

Laser reballing completed alongside programming and taping at the same facility. One visit, multiple processes — reducing lead time and handling.

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FAQ's

Below we have answered some common questions, however if the answer you're looking for isn't here please call us on +44 (0)1604 491107 or email via our contact form.

What is BGA laser reballing?

BGA laser reballing is the process of removing worn or damaged solder balls from a Ball Grid Array (BGA) package and replacing them with new, precision-placed balls of the correct alloy and pitch. A laser is used to cleanly remove residual solder from each pad without thermal stress to the component body, making it the preferred method for high-value or sensitive devices where rework quality is critical.

What ball pitch sizes can you reball?

We reball BGA packages with ball pitches from 0.4 mm to 1.27 mm, covering the full range of standard and fine-pitch devices used in aerospace, defence, and industrial electronics. If your component falls outside this range, contact us with the package datasheet and we will confirm suitability before quoting.

What solder alloys do you offer for BGA reballing?

We offer SAC305 (lead-free), Sn63Pb37 (eutectic tin-lead), and low-temperature bismuth-tin alloys. Alloy selection is driven by your assembly process, operating environment, and any applicable standards such as J-STD-001 or customer-specific requirements. We will confirm the correct alloy with you at the quoting stage.

Is your BGA reballing service compliant to IPC standards?

Our reballing process is carried out working to IPC-7711/7721 rework and repair standards. Systemation Euro is working towards AS9100 Rev D quality management requirements and JOSCAR accreditation, making our service suitable for aerospace and defence supply chains where full process traceability is required.

How do I get a quote for BGA reballing?

Call us on +44 (0)1604 491107 or email info@systemationeuro.com with your component part number, quantity, ball pitch, and required alloy if known. We will respond with a written quotation, typically within one working day.

Systemation Euro

Other Services We Offer

Device Programming

IC programming services, complemented by dedicated device storage and handling.

SMD Taping & Reeling

Our automatic Taping & Reeling machines provide efficient, repeatable processing for our customers.

Bare Die Tape & Reel

We process CSP, WLCSP and flip chip devices from wafer, film frame and waffle pack into EIA-481-F compliant carrier tape.

Axial & Radial Taping

We tape and reel a wide range of axial and radial components including capacitors, resistors, diodes and springs.

Laser Marking

We use a concentrated beam of light to create permanent marks on the surfaces of target components.

Dry Packing

We offer a full dry packing service for all moisture-sensitive components.

OEM Project Support

Work with experienced operators who have full knowledge of the machines who can quickly have your cell operating.

Consumables Supply

In addition to the extensive services provided by Systemation Euro, we also supply a complete range of consumables.

Schedule a consultation with one of our specialists today to determine the perfect service solution.