Bare Die Tape and Reel

Systemation Euro provides bare die tape and reel UK services for wafer level CSP, WLCSP, flip chip and die package devices. We take unpackaged semiconductor die from wafer, film frame, waffle pack or loose format and place them into EIA-481-D compliant carrier tape, ready for direct SMT line-feed. Based in Northampton, with shipping available across the UK and Europe.

Our bare die tape and reel service is available standalone or combined with IC programming, laser marking, dry packing and BGA laser reballing for a complete component finishing solution under one roof.

Bare die tape and reel often forms part of a wider finishing process alongside our IC programming and laser reballing services, with dry packing and carrier tape options available depending on the package format you need.

Our Bare Die Tape and Reel Capabilities

Input Formats Accepted

Wafer (6″, 8″ and 12″), film frame, waffle pack, and loose die. All formats processed through automated die handlers with integrated vision inspection.

Die Size Range

0.5mm square to 12mm square, suitable for the full range of CSP, WLCSP, micro-BGA, bumped die and flip chip packages used in automotive, defence, aerospace and medical applications.

Minimum Die Thickness

Processing down to 60 micron thickness, with precision handling throughout to prevent cracking or chipping of ultra-thin devices.

Supported Processes

Film Frame Mount (6″, 8″ and 12″ wafers)
Wafer to Tape & Reel
Waffle Pack to Tape & Reel
Wafer to Waffle Pack
Inspection for defects
Packaging and Distribution

Substrate Materials

Silicon, glass, ceramic and FR4-based wafer level devices all supported.

EIA-481-D Compliance

All bare die tape and reel processing is compliant to the EIA-481-D standard throughout.

Controlled Environment

ESD, humidity and temperature controlled production environment, with cleanroom processing available for devices requiring a protected environment.

Inspection

Automated inspection of die and flip chip for cracking, chipping, bump coplanarity and orientation, built into the taping process.

Traceability

Full lot traceability and documentation, essential for aerospace, defence and medical programmes requiring complete process records.

UK-Based Service

Based in Northampton, central England, for faster turnaround for UK and Midlands manufacturers, with Europe-wide shipping available. See our UK specialist page for more on why manufacturers choose UK-based processing.

About Our Bare Die Tape and Reel Process

Bare die tape and reel is the process of taking unpackaged semiconductor die, supplied as diced wafer on film frame, in waffle packs, or as loose die, and placing them precisely into carrier tape for automated SMT pick-and-place assembly. This allows manufacturers to use bare die and wafer level packages directly on standard SMT lines without manual handling, reducing placement errors and protecting fragile devices throughout the supply chain.

Systemation Euro uses automated die handlers with high-resolution vision systems to place, inspect and reel bare die to customer specification. Every reel is produced to EIA-481-D standard with customer-defined pitch, pocket dimensions and reel format, ready for direct line-feed.

Typical applications include automotive sensor packaging, defence and aerospace component supply chain processing, medical device assembly, RFID and cellphone component finishing, and redistribution of wafer level CSP product for contract electronics manufacturers.

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Customer Enquiries

01604 491107

info@systemationeuro.com

Typical applications include: automotive sensor packaging, defence and aerospace component supply chain processing, medical device assembly, RFID and cellphone component finishing, and redistribution of wafer level CSP product for contract electronics manufacturers.

Quality and Compliance

Systemation Euro is certified to ISO 9001:2015, audited and accredited by UKAS. We operate in compliance with AS9100 Rev D and ISO 14001:2015 environmental management standards, and are working towards JOSCAR accreditation. All bare die tape and reel services are carried out at our Northampton facility.

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Controlled Handling

Bare die components handled under controlled conditions throughout, minimising contamination risk and electrostatic damage from receipt to despatch.

Custom Tape Solutions

Bare die taped to customer-specified pocket profiles, cover tape type, reel quantity, and labelling requirements. Custom configurations available.

Quality Assurance

All bare die processing carried out within our ISO 9001:2015 UKAS-accredited quality management system. Compliant with AS9100 Rev D.

Full Traceability

Batch records maintained from incoming die count through to tape-and-reel output. Traceability documentation provided on request.

Same-Site Processing

Bare die taping carried out alongside alloy conversion and programming on one site, reducing handling steps and associated contamination risk.

Responsive Service

Bare die requirements discussed directly with experienced engineers. Call 01604 491107 to confirm suitability and turnaround for your component.

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FAQ's

Below we have answered some common questions, however if the answer you're looking for isn't here please call us on +44 (0)1604 491107 or email via our contact form.

What is bare die tape and reel?

Bare die tape and reel is the process of taking unpackaged semiconductor die – supplied as diced wafer, waffle pack or loose die – and placing them into carrier tape for automated SMT assembly. It allows bare die and wafer level CSP devices to be handled and placed on standard pick and place equipment without manual intervention, protecting fragile devices and enabling high-volume production.

What input formats do you accept for bare die processing?

Systemation Euro accepts bare die in wafer format (6″, 8″ and 12″ on film frame), waffle pack, and loose die. Contact us with your specific format and we will confirm suitability and processing options before quoting.

What die sizes can you process?

We process die sizes from 0.5mm square to 12mm square, covering the full range of CSP, WLCSP, micro-BGA, bumped die and flip chip packages. Minimum die thickness is 60 micron.

Is your bare die tape and reel EIA-481-D compliant?

Yes. All bare die and CSP tape and reel processing at Systemation Euro is compliant with EIA-481-D throughout, ensuring compatibility to standard pick and place equipment and customer reel specifications.

What substrate materials can you process?

We process wafer level devices on silicon, glass, ceramic and FR4 substrates. If you have an unusual substrate material, contact us with the device specification and we will confirm suitability.

Can bare die processing be combined with other services?

Yes – this is one of Systemation Euro’s key advantages. Bare die tape and reel can be combined with IC programming, laser marking, dry packing and BGA laser reballing in a single workflow at our Northampton facility, reducing lead times, logistics costs and supplier management overhead.

What industries do you serve with bare die tape and reel?

We serve automotive, defence, aerospace, medical, industrial, sensor and semiconductor distribution customers. We operate in compliance with AS9100 Rev D and are working towards JOSCAR accreditation, supporting defence and aerospace supply chain qualification requirements.

How do I get a quote for bare die tape and reel?

Call us on +44 (0)1604 491107 or email info@systemationeuro.com with your die format, size, quantity and required reel specification. We will respond with a written quotation, typically within one working day.

Systemation Euro

Other Services We Offer

Device Programming

IC programming services, complemented by dedicated device storage and handling.

SMD Taping & Reeling

Our automatic Taping & Reeling machines provide efficient, repeatable processing for our customers.

Laser Marking

We use a concentrated beam of light to create permanent marks on the surfaces of target components.

Axial & Radial Taping

We tape and reel a wide range of axial and radial components including capacitors, resistors, diodes and springs.

Lead Pre-forming

Systemation Euro provides a pre-forming service tailored for both active and passive discrete components.

Dry Packing

We offer a full dry packing service for all moisture-sensitive components.

OEM Project Support

Work with experienced operators who have full knowledge of the machines who can quickly have your cell operating.

Consumables Supply

In addition to the extensive services provided by Systemation Euro, we also supply a complete range of consumables.

Schedule a consultation with one of our specialists today to determine the perfect service solution.