X-Ray Inspection of Electronic Components UK

X-Ray Inspection for Counterfeit Detection

Systemation Euro provides X-ray inspection for OEMs, distributors and contract electronics manufacturers who need to see inside a component without opening it. X-ray reveals internal construction that surface inspection cannot reach, and the part remains intact afterwards.

Our X-Ray Inspection Capabilities

X-ray imaging is particularly valuable for BGA, QFN and other packages where the die attach and solder interface are hidden from view.

Die Placement Verification

Confirms the die is present, correctly positioned and proportionate to the declared device.

Bond Wire Inspection

Wire count, routing and attachment points compared against known-good reference parts.

Void Detection

Voiding within solder joints and die attach identified without sectioning the component.

Lead Frame Assessment

Internal lead frame geometry checked for consistency across the batch.

Mixed Batch Identification

Internal differences between parts reveal batches assembled from more than one source.

Image Records

Radiographic images retained and supplied as part of your inspection evidence.

Request a Sample Report

See exactly what you get back. Send your details and we will share a sample inspection report, plus pricing for your batch.

Need more help?

Our team of experts are ready to answer your questions:

Customer Enquiries

01604 491107

info@systemationeuro.com

About Our X-Ray Inspection Process

X-ray inspection passes radiation through a component and captures the resulting image, revealing internal structure without opening the package. Denser materials such as the die, bond wires and lead frame appear clearly, allowing construction to be assessed against a known-good reference.

For counterfeit detection this is often where a convincing external fake is exposed. A component may carry perfect markings and pass visual inspection, yet contain no die at all, a die of the wrong size, or a bond wire pattern that does not match the declared part. It sits alongside XRF analysis in the non-destructive stage of a layered counterfeit component testing process.

Where X-ray raises a concern that cannot be resolved without opening the part, decapsulation and die level analysis is the usual next step on a small sample from the batch.

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Get an X-Ray Inspection Quote

Send us the part numbers, quantities and package types. We will confirm sample sizes and turnaround for X-ray inspection of your batch.

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Non-Destructive

Components are returned intact and fully usable after testing, so the batch stays available for production.

Independent Inspection

Testing carried out independently of the supply chain, giving unbiased results for your incoming inspection records.

Quality Assurance

All work operated within our ISO 9001:2015 UKAS-accredited quality management system. Working towards AS9100 Rev D and AS6171.

Full Traceability

Incoming component records, test parameters and inspection findings maintained for every batch we handle.

Package Range

X-ray inspection carried out across BGA, QFN, QFP, SOIC and other surface-mount packages. Contact us to confirm suitability.

Same-Site Processing

Testing completed alongside programming, taping and reeling at the same Northampton facility. One supplier, one point of contact.

Need Help?

FAQ's

Below we have answered some common questions, however if the answer you're looking for isn't here please call us on +44 (0)1604 491107 or email via our contact form.

What is X-ray inspection of electronic components?

X-ray inspection captures an image of a component’s internal structure by passing radiation through the package. It reveals the die, bond wires and lead frame without opening or damaging the part.

Is X-ray inspection destructive?

No. X-ray is entirely non-destructive. Components are returned intact and remain usable in production afterwards.

What can X-ray detect that visual inspection cannot?

It reveals missing or wrongly sized die, incorrect or absent bond wires, voiding, and internal construction that does not match the declared part. These defects are invisible from the outside.

Which packages benefit most from X-ray inspection?

BGA, QFN and other packages where the solder interface and die attach are hidden beneath the body, since no surface method can assess them.

Do you supply images with the results?

Yes. Radiographic images are retained and supplied with a written report suitable for your incoming inspection and audit records.

Systemation Euro

Other Services We Offer

Device Programming

IC programming services, complemented by dedicated device storage and handling.

SMD Taping & Reeling

Our automatic Taping & Reeling machines provide efficient, repeatable processing for our customers.

Bare Die Tape & Reel

We process CSP, WLCSP and flip chip devices from wafer, film frame and waffle pack into EIA-481-F compliant carrier tape.

Axial & Radial Taping

We tape and reel a wide range of axial and radial components including capacitors, resistors, diodes and springs.

Laser Marking

We use a concentrated beam of light to create permanent marks on the surfaces of target components.

Dry Packing

We offer a full dry packing service for all moisture-sensitive components.

OEM Project Support

Work with experienced operators who have full knowledge of the machines who can quickly have your cell operating.

Consumables Supply

In addition to the extensive services provided by Systemation Euro, we also supply a complete range of consumables.

Schedule a consultation with one of our specialists today to determine the perfect service solution.

X-Ray Inspection and Internal Structure Analysis