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FAQ's
Below we have answered some common questions, however if the answer you're looking for isn't here please call us on +44 (0)1604 491107 or email via our contact form.
What is decapsulation testing?
Decapsulation is the controlled removal of a component’s outer package to expose the silicon die underneath. The die is then examined under magnification to verify manufacturer markings, geometry and process node against the original datasheet.
Is decapsulation destructive?
Yes. The component cannot be returned to service afterwards, which is why it is carried out on a small sample drawn from the batch rather than the whole delivery. The remainder stays intact and usable.
When should decapsulation be used instead of non-destructive testing?
It is used when non-destructive methods return an inconclusive result, or where the value or risk profile of the batch justifies definitive verification. High-value semiconductors and open-market sourced parts are the usual candidates.
What does die level analysis reveal?
Die level analysis exposes re-marked parts, cloned die, wrong die inside a correct package, and components harvested from used assemblies. These are defects that surface inspection and X-ray cannot reliably detect.
Do you provide documentation with the results?
Yes. Every batch is supplied with a written report including test parameters, photographic evidence and pass or fail findings, suitable for your incoming inspection and audit records.
