Component Reclaim & Recovery UK

Recover Components From Your Own Boards for Re-Use

Where a component is obsolete, scarce or expensive, the parts you already own may be the fastest route to keeping production running. Systemation Euro recovers devices from your end-of-life, surplus or scrap boards, restores them to a usable condition and returns them to you.

What Component Recovery Involves

Recovery is a closed loop. The boards are yours, the recovered parts stay yours, and nothing is sourced from the open market, which removes counterfeit risk entirely.

Safe Device Removal

Components removed under controlled heat to avoid thermal damage to the die or package.

Lead Straightening

Bent or misaligned leads straightened and coplanarity restored for automated placement.

Re-Tinning

Oxidised or contaminated terminations refinished so they solder reliably in your new build.

Laser Reballing

BGA and CSP packages reballed where the original solder has degraded or the alloy needs updating.

Authenticity and Function Testing

XRF, visual and electrical testing to confirm recovered parts are sound before return.

Re-Reeling and Dry Pack

Parts returned in tape and reel, dry packed to JEDEC requirements where moisture sensitivity demands it.

Request a Callback

Submit your details and our team will get back to you about recovering components from your boards.

Need more help?

Our team of experts are ready to answer your questions:

Customer Enquiries

01604 491107

info@systemationeuro.com

Why Recovery Is Worth Considering

Component shortages, long lead times and obsolescence have made recovery a mainstream option rather than a last resort. If a device is no longer manufactured, the stock already sitting on your scrap or surplus boards may be the only supply that exists.

The commercial case is often stronger than it first appears. A single high-value FPGA or processor recovered from a faulty board can be worth more than the entire recovery job. Where a board has failed for reasons unrelated to its most expensive components, scrapping it discards working silicon.

The supply chain argument matters just as much. Recovered parts come from your own material, so their provenance is known. That removes the counterfeit exposure that comes with broker and open-market sourcing during shortage, which is where counterfeit risk is highest.

There is an environmental dimension too. Electronic waste is one of the fastest growing waste streams globally, and recovering serviceable devices keeps them in use rather than in landfill. For organisations with circular economy or scope 3 reporting commitments, recovery is a measurable contribution rather than a gesture.

Our Component Recovery Process

Board Assessment

You send the boards. We identify which devices are worth recovering and confirm expected yield.

Pre-Bake

Boards baked to drive out absorbed moisture before any heat is applied, preventing package cracking.

Visual Inspection

Target devices inspected in situ and recorded before removal.

Controlled Removal

Devices removed under controlled heat to avoid thermal stress.

Lead Straightening and Coplanarity

Terminations straightened and checked so parts will place correctly.

Re-Tinning or Reballing

Terminations refinished, or BGA packages reballed, to restore solderability.

Testing

XRF, visual and electrical testing to confirm the recovered devices are sound.

Post-Bake and Packing

Parts baked, dry packed where required, re-reeled and returned with documentation.

REQUEST A QUOTE

Get a Component Recovery Quote

Tell us what boards you have and which devices you need back. We will advise on expected yield, process and cost before you commit.

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Closed Loop

Your boards, your components, returned to you. No open-market sourcing and no counterfeit exposure.

Tested Before Return

Recovered devices verified by XRF, visual and electrical testing before they go back to you.

Quality Assurance

Operated within our ISO 9001:2015 UKAS-accredited quality management system. Working towards AS9100 Rev D and AS6171.

Full Traceability

Every device recorded from incoming board through to returned part.

Moisture Control

Pre-bake and post-bake to JEDEC requirements, with dry packing where needed.

Single-Site Service

Removal, refinishing, testing and packing completed at one Northampton facility.

Need Help?

FAQ's

Below we have answered some common questions, however if the answer you're looking for isn't here please call us on +44 (0)1604 491107 or email via our contact form.

What is component recovery?

Component recovery is the process of removing serviceable devices from end-of-life, surplus or scrap circuit boards, restoring them to a usable condition and returning them for re-use in new production.

Do the recovered components stay mine?

Yes. Recovery is a closed loop using your own boards. The parts remain your property throughout and are returned to you, which is why there is no counterfeit exposure.

Which components are worth recovering?

Typically high-value or obsolete devices such as FPGAs, processors, memory and specialist ICs, particularly where replacements are no longer manufactured or carry long lead times.

Will recovered parts be reliable?

Recovered devices are tested before return using XRF, visual and electrical methods. Parts that do not pass are reported rather than returned as usable.

Can you recover from boards that have failed?

Yes. Boards frequently fail for reasons unrelated to their most valuable components, so the expensive devices are often still fully serviceable.

How are moisture-sensitive devices handled?

Boards are baked before removal to prevent package cracking, and recovered parts are baked again and dry packed to JEDEC requirements where their moisture sensitivity level demands it.

Systemation Euro

Other Services We Offer

Device Programming

IC programming services, complemented by dedicated device storage and handling.

SMD Taping & Reeling

Our automatic Taping & Reeling machines provide efficient, repeatable processing for our customers.

Bare Die Tape & Reel

We process CSP, WLCSP and flip chip devices from wafer, film frame and waffle pack into EIA-481-F compliant carrier tape.

Axial & Radial Taping

We tape and reel a wide range of axial and radial components including capacitors, resistors, diodes and springs.

Laser Marking

We use a concentrated beam of light to create permanent marks on the surfaces of target components.

Dry Packing

We offer a full dry packing service for all moisture-sensitive components.

OEM Project Support

Work with experienced operators who have full knowledge of the machines who can quickly have your cell operating.

Consumables Supply

In addition to the extensive services provided by Systemation Euro, we also supply a complete range of consumables.

Schedule a consultation with one of our specialists today to determine the perfect service solution.

Component Reclaim and Recovery