Electronics Terminology Glossary

A fan-folded cardboard packaging format for taped components, used as an alternative to a reel. Holds the same taped carrier but folded into a box rather than wound, which suits some feeders and reduces packaging bulk.

SAE standard covering counterfeit avoidance for electronic parts, setting out how organisations should mitigate the risk of counterfeit parts entering the supply chain.

SAE standard aimed at independent distributors and brokers, defining requirements for avoiding, detecting and disposing of suspect counterfeit electronic parts sourced outside authorised channels.

SAE standard defining the test methods used to detect suspect and counterfeit electronic parts, including visual inspection, XRF, X-ray, decapsulation and electrical testing. Laboratories are normally expected to hold ISO/IEC 17025 accreditation covering the methods they apply.

A counterfeit technique where a coating is applied over a component package to hide the original markings before new ones are printed. Revealed by heated solvent testing.

The fine wire connecting the silicon die to the component lead frame. Wire count, routing and attachment are examined during X-ray inspection to confirm a part matches its declared type.

The embossed or punched tape that holds components in individual pockets for automated assembly, manufactured to the EIA-481 standard.

The clear film sealed over carrier tape to retain components in their pockets during handling and transport.

An electrical test that applies a controlled voltage across each pin and measures the resulting current, producing a signature compared against a known-good reference device.

A short length of carrier tape supplied instead of a full reel, typically for prototype or low-volume requirements. Cheaper per order but not suited to high-speed automated placement.

The controlled removal of a component package to expose the silicon die for direct examination. Destructive, so applied to a sample rather than a full batch.

The piece of silicon carrying the actual circuit, sitting inside the component package. Die markings and geometry are compared against the manufacturer datasheet during authenticity testing.

A packaging process for moisture-sensitive devices where components are baked, sealed in a moisture barrier bag with desiccant and a humidity indicator card, then labelled with their moisture sensitivity level.

The industry standard defining carrier tape and reel dimensions, pocket pitch, sprocket holes and reel sizes for automated component handling.

Electrostatic discharge. Sudden current flow that can damage semiconductors, controlled through grounded handling procedures, conductive packaging and controlled work areas.

Components sold outside the authorised distribution network. Legitimate parts can circulate this way, but counterfeit prevalence is significantly higher than in authorised channels.

A card sealed inside a moisture barrier bag that changes colour to show whether the contents have been exposed to moisture beyond acceptable limits.

Conductive residue on a component surface, commonly from flux left by a previous soldering operation. Elevated readings indicate a part may have been reclaimed from a used assembly.

The standards body governing semiconductor packaging and handling, including the moisture sensitivity level classifications used in dry packing.

The metal structure inside a component package that connects the die to the external leads or terminations.

A sealed foil bag used to protect moisture-sensitive components from humidity during storage and transport.

Moisture Sensitivity Level. A classification from 1 to 6 defining how long a component may be exposed to ambient conditions before it must be baked prior to soldering.

Package cracking caused by trapped moisture turning to steam during reflow soldering. Prevented by correct dry packing and observing floor life limits.

Removing and replacing the solder balls on a BGA package, used for alloy conversion, recovering damaged parts and supporting obsolete devices.

Applying false markings to a component to present it as a different, newer or higher-specification part. One of the most common counterfeit techniques.

Restriction of Hazardous Substances. European legislation limiting lead and other substances in electronics, verified on component finishes using XRF analysis.

Whether a component termination will accept solder and form a reliable joint. Degrades with age, oxidation and contamination.

Packaging components into carrier tape wound onto a reel, the standard format for automated pick and place assembly.

Microscopic conductive filaments that can grow from pure tin finishes over time, capable of bridging adjacent conductors and causing short circuits. A known risk in long-life, high-reliability equipment.

The ability to track a component through the supply chain and through each process applied to it, using retained records of source, batch and handling.

X-Ray Fluorescence analysis. A non-destructive method measuring the elemental composition of component leads and terminations, used for RoHS verification and counterfeit detection.