Embossed Carrier Tape Manufacturer

Custom Embossed Carrier Tape, Thermoformed in the UK

Embossed carrier tape holds each component in a moulded three-dimensional pocket, protecting it in transit and presenting it to a pick-and-place machine in a fixed orientation. We form it in-house in widths from 8 mm to 200 mm, with pockets to 30 mm deep, on a two-week turnaround.

Our Embossed Carrier Tape Capability

Thermoformed In-HouseAutomatic thermoforming machines at our Northampton facility, not subcontracted overseas.
8 mm to 200 mmFull width range with pocket depths to 30 mm, including deep pocket forming.
Five MaterialsPC, PET, PP, PS and PVC, in antistatic or dissipative grades for ESD-sensitive parts.
Custom Tooling On SiteTooling designed and cut here, which is what makes a two-week turnaround possible.
EIA-481-D DesignedPocket sizing and sprocket placement to EIA-481-D, DIN IEC 60286-3 and JIS C 0806.
Deviations WelcomeWhere a component needs a non-standard pocket, we can form outside the specification.

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Send us your A0, B0 and K0 pocket dimensions and we will come back with a quote and lead time.

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Our team of experts are ready to answer your questions:

info@systemationeuro.com

Embossed or Punched: Choosing the Right Carrier Tape

Carrier tape comes in two broad forms and the choice is driven by the shape of the part, not by cost alone.

Embossed carrier tape is thermoformed. Heated plastic film is drawn into a mould to create a three-dimensional pocket shaped around the component. Because the cavity is moulded rather than cut, it can hold taller parts, parts with uneven undersides and parts that need to arrive in a precise orientation. This is the format used for integrated circuits, connectors, modules and most precision devices.

Punched carrier tape has shallow flat-bottomed pockets punched through a flat sheet, with a backing layer closing the underside. It works well for small, flat, low-profile parts such as chip resistors and capacitors, where pocket depth is not doing any work.

If a part is more than a millimetre or two deep, has an irregular profile, or has to present a specific face to the nozzle, embossed tape is the answer. We manufacture embossed tape in-house on automatic thermoforming machines at our Northampton facility.

Specifications We Can Form

Widths from 8 mm to 200 mm, pocket depths to 30 mm including deep pocket forming. Materials are PC, PET, PP, PS and PVC, each available in antistatic or dissipative grades where the component needs ESD protection.

Pocket dimensions are specified as A0 (length), B0 (width) and K0 (depth), measured to hold the component with enough clearance to load and unload cleanly but not so much that it can rotate in the pocket. Send us those three figures and we can quote from them directly.

Every design is built to EIA-481-D, alongside DIN IEC 60286-3 and JIS C 0806, so sprocket pitch and pocket position match what pick-and-place equipment expects. Where a customer needs something outside the standard, we can produce that too.

Why Tooling Location Decides Your Lead Time

Most carrier tape sold in Europe and North America is formed in Southeast Asia. That is fine for a standing production part, but it means a new pocket geometry involves shipping a tooling specification halfway around the world and waiting.

We design tooling, cut it and form the tape on the same site, which is how we hold a two-week turnaround from receipt of order. For a design change late in a project, or a part that has just gone obsolete in its original packaging, that difference is usually what matters.

Embossed tape is normally supplied alongside our SMD taping and reeling service, and is used in our bare die tape and reel process. For moisture-sensitive parts it pairs with dry packing.

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Get an Embossed Carrier Tape Quote

Tell us the component and the pocket dimensions, or send a sample, and we will quote tooling and tape together.

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Laser Process

BGA and chip-scale packages reballed using a controlled laser process, providing consistent, repeatable results without the variation of manual re-balling.

Alloy Flexibility

Reballing available in lead-free, tin-lead, and other alloy specifications to match your board assembly requirements.

All reballed components inspected before despatch. Operated within our ISO 9001:2015 UKAS-accredited quality management system. Working towards AS9100 Rev D.

Full Traceability

Incoming component records, process parameters, and inspection results maintained for every batch. Documentation available on request.

Package Range

Reballing carried out on BGA packages from micro-BGA through to large area array devices. Contact us to confirm suitability for your component.

Same-Site Processing

Laser reballing completed alongside programming and taping at the same facility. One visit, multiple processes — reducing lead time and handling.

Need Help?

FAQ's

Below we have answered some common questions, however if the answer you're looking for isn't here please call us on +44 (0)1604 491107 or email via our contact form.

Embossed carrier tape is a plastic tape with three-dimensional pockets thermoformed into it, each shaped to hold one component. It presents devices to a pick-and-place machine in a fixed orientation and protects them from physical and electrostatic damage in transit and storage.

Embossed tape is thermoformed, so the pocket is a moulded three-dimensional cavity that can be shaped closely around the component. Punched tape has shallow flat-bottomed pockets cut through a flat sheet, backed with a paper or film layer. Embossed suits taller or awkwardly shaped parts and anything needing tight positional control. Punched suits small, flat, low-profile parts where pocket depth is not a factor.

We form pockets up to 30 mm deep, including deep pocket forming, across tape widths from 8 mm to 200 mm. Material thickness is set by the tape design, the cavity and any customer-specific requirement.

PC, PET, PP, PS and PVC, each available in antistatic or dissipative versions. Material choice depends on pocket geometry, the sensitivity of the component and how the tape will be handled downstream.

A new pocket geometry needs its own tooling. We design and cut tooling on site, which is why we can quote a two-week turnaround from receipt of order rather than the longer lead times typical of tape formed in Southeast Asia.

Yes. Pocket sizing, sprocket hole placement and material thickness are designed to EIA-481-D, alongside DIN IEC 60286-3 and JIS C 0806, so the tape feeds correctly on pick-and-place equipment wherever your boards are assembled. We can also produce tape that deviates from these standards where a customer asks for it.

Systemation Euro

Other Services We Offer

Device Programming

IC programming services, complemented by dedicated device storage and handling.

SMD Taping & Reeling

Our automatic Taping & Reeling machines provide efficient, repeatable processing for our customers.

Bare Die Tape & Reel

We process CSP, WLCSP and flip chip devices from wafer, film frame and waffle pack into EIA-481-F compliant carrier tape.

Axial & Radial Taping

We tape and reel a wide range of axial and radial components including capacitors, resistors, diodes and springs.

Laser Marking

We use a concentrated beam of light to create permanent marks on the surfaces of target components.

Dry Packing

We offer a full dry packing service for all moisture-sensitive components.

OEM Project Support

Work with experienced operators who have full knowledge of the machines who can quickly have your cell operating.

Consumables Supply

In addition to the extensive services provided by Systemation Euro, we also supply a complete range of consumables.

Contact Us

Schedule a consultation with one of our specialists today to determine the perfect service solution.