EIA-481-D Carrier Tape Specification

What EIA-481-D Covers, and Why It Matters

EIA-481 is the standard that lets a pick-and-place machine handle tape from a supplier it has never seen before. It defines tape width, sprocket pitch, pocket position, cover tape peel force and reel dimensions. We design every custom carrier tape to EIA-481-D.

What the Standard Specifies

Tape Width and Tolerance8 mm to 200 mm with the tolerances that keep tape tracking straight in the feeder.
Sprocket PitchHole diameter and spacing that drive the tape and set the index distance.
Pocket PositionWhere the pocket sits relative to the sprocket holes, so the nozzle lands on centre.
Cover Tape Peel Force0.1-1.0 N at 8 mm, up to 1.5 N on wider tape, and stable across the whole reel.
Reel DimensionsHub and flange sizing, plus leader and trailer make-up for machine loading.
Equivalent StandardsDesigned alongside DIN IEC 60286-3 and JIS C 0806 for use outside Europe.

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Why One Standard Governs All Carrier Tape

A pick-and-place machine has no way of knowing who made the tape it is being fed. It indexes the tape by its sprocket holes and expects a component to be sitting at a known position, at a known depth, every time. EIA-481 is what makes that assumption safe.

The standard covers tape width and tolerance, sprocket hole diameter and pitch, pocket position relative to the sprocket holes, pocket pitch, cover tape peel force, and reel hub and flange dimensions. Between them these define everything a feeder needs to handle tape it has never seen before.

EIA-481-D is the revision we work to. Earlier revisions split the specification across separate parts by tape width; the D revision brought them into a single document.

Peel Force: The Specification People Forget

Cover tape peel force gets less attention than pocket dimensions and causes more problems. EIA-481 sets it between 0.1 N and 1.0 N for 8 mm tape, 0.1 N to 1.3 N for 12 mm to 56 mm, and 0.1 N to 1.5 N above that.

The number matters less than its consistency. Peel force that climbs partway through a reel will lift components out of pockets or stall the feeder, and it typically shows up hours into a run rather than at setup, which makes it expensive to diagnose.

That is one of the reasons we form tape and seal it as part of the same process rather than buying formed tape in, so the relationship between the pocket and the cover tape is controlled in one place.

Designing to the Standard, and Around It

We design every custom carrier tape to EIA-481-D alongside DIN IEC 60286-3 and JIS C 0806, so pocket sizing, sprocket placement and material thickness suit pick-and-place equipment wherever your boards are assembled, not just in the UK.

Where a component genuinely will not fit within the standard, we can produce tape that deviates from it, including deep pocket designs to 30 mm. That is a deliberate decision rather than a default, and worth agreeing with the assembly line beforehand.

The standard applies equally to embossed carrier tape and to the reels produced through our SMD taping and reeling and axial and radial taping services.

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Laser Process

BGA and chip-scale packages reballed using a controlled laser process, providing consistent, repeatable results without the variation of manual re-balling.

Alloy Flexibility

Reballing available in lead-free, tin-lead, and other alloy specifications to match your board assembly requirements.

All reballed components inspected before despatch. Operated within our ISO 9001:2015 UKAS-accredited quality management system. Working towards AS9100 Rev D.

Full Traceability

Incoming component records, process parameters, and inspection results maintained for every batch. Documentation available on request.

Package Range

Reballing carried out on BGA packages from micro-BGA through to large area array devices. Contact us to confirm suitability for your component.

Same-Site Processing

Laser reballing completed alongside programming and taping at the same facility. One visit, multiple processes — reducing lead time and handling.

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FAQ's

Below we have answered some common questions, however if the answer you're looking for isn't here please call us on +44 (0)1604 491107 or email via our contact form.

EIA-481 is the standard that defines how components are packaged in continuous tape for automated handling. It sets tape widths, sprocket hole placement, pocket position and pitch, cover tape peel force limits and reel dimensions, so that tape from any compliant supplier feeds correctly on any compliant pick-and-place machine.

EIA-481-D is the revision we work to. It consolidated the earlier separate parts of the standard into a single document. We design all carrier tape to EIA-481-D alongside DIN IEC 60286-3 and JIS C 0806.

The main areas are tape width and the tolerances on it, sprocket hole diameter and pitch, the position of pockets relative to the sprocket holes, pocket pitch, cover tape peel force limits, reel hub and flange dimensions, and how the leader and trailer sections of a reel are made up.

EIA-481 sets cover tape peel force between 0.1 N and 1.0 N for 8 mm tape, 0.1 N to 1.3 N for 12 mm to 56 mm tape, and 0.1 N to 1.5 N for wider tape. Just as important, the force should stay stable from the start of the reel to the end, because a peel force that climbs partway through a reel is a common cause of feeder faults.

They are the European and Japanese equivalents covering the same ground. In practice they are closely aligned with EIA-481, and tape designed to all three feeds correctly regardless of where the boards are assembled. We design to all three as standard.

Yes, and sometimes it has to. A component that will not fit inside a standard pocket needs a non-standard design. We can produce that, but non-standard tape may need feeder adjustment at the assembly end, so it is worth agreeing with whoever runs the line before committing to tooling.

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Other Services We Offer

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IC programming services, complemented by dedicated device storage and handling.

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Our automatic Taping & Reeling machines provide efficient, repeatable processing for our customers.

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We process CSP, WLCSP and flip chip devices from wafer, film frame and waffle pack into EIA-481-F compliant carrier tape.

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We tape and reel a wide range of axial and radial components including capacitors, resistors, diodes and springs.

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We use a concentrated beam of light to create permanent marks on the surfaces of target components.

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We offer a full dry packing service for all moisture-sensitive components.

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Work with experienced operators who have full knowledge of the machines who can quickly have your cell operating.

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