Carrier Tape Materials and ESD Grades

PC, PET, PP, PS and PVC, in Antistatic and Dissipative Grades

Material choice is an engineering decision, not a preference. Pocket depth, component weight and ESD sensitivity all point to different materials, and the wrong grade produces failures that are almost impossible to trace back to packaging. Here is how we choose.

Materials and Grades We Form

PS and PETThe workhorses, covering the majority of pocket geometries and component types.
PCChosen where the pocket is deep or the component heavy enough to load the pocket walls.
PP and PVCSelected for specific chemical or temperature requirements.
Antistatic GradesResist charge building as tape moves against itself or runs through a feeder.
Dissipative GradesAllow accumulated charge to bleed away rather than discharge through a component.
Thickness by DesignSet against cavity depth, because a deep pocket draws the film thinner as it forms.

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Five Materials, and What Drives the Choice

We form carrier tape in PC, PET, PP, PS and PVC. Material is not a preference, it is an engineering decision driven by three things: how deep the pocket is, how heavy or delicate the component is, and what happens to the tape between our facility and your placement machine.

PS and PET cover the majority of requirements. PC tends to be chosen where the pocket is deep or the part is heavy enough that pocket walls need to hold their shape under load. PP and PVC are selected for specific chemical or temperature reasons.

Material thickness is set at design stage rather than picked from a list. A deep cavity draws the film thinner as it forms, so a deeper pocket generally starts from a thicker material.

Antistatic and Dissipative Grades

Every material is available in antistatic or dissipative versions. The two are not interchangeable and the difference matters for sensitive devices.

Antistatic material resists building a charge in the first place, which is what you want when tape moves against itself on a reel or runs through a feeder. Dissipative material goes further, allowing any charge that does accumulate to bleed away in a controlled way rather than discharging suddenly through a component.

Which you need is set by the ESD sensitivity class on the component datasheet. Passive and mechanical parts generally need neither. Integrated circuits, discrete semiconductors and anything with an exposed gate usually do, and getting this wrong produces failures that are effectively impossible to trace back to packaging.

Beyond ESD: Moisture and Mechanical Parts

ESD is not the only thing carrier tape protects against. For moisture-sensitive devices the tape works alongside dry packing to keep components inside their handling limits from our facility through to your line.

The same thermoforming process also handles small mechanical components that need presenting to an automated assembly machine in a fixed orientation. ESD grades are usually unnecessary there, which takes cost out.

Whatever the material, the pocket is designed to EIA-481-D and formed as embossed carrier tape on site.

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Laser Process

BGA and chip-scale packages reballed using a controlled laser process, providing consistent, repeatable results without the variation of manual re-balling.

Alloy Flexibility

Reballing available in lead-free, tin-lead, and other alloy specifications to match your board assembly requirements.

All reballed components inspected before despatch. Operated within our ISO 9001:2015 UKAS-accredited quality management system. Working towards AS9100 Rev D.

Full Traceability

Incoming component records, process parameters, and inspection results maintained for every batch. Documentation available on request.

Package Range

Reballing carried out on BGA packages from micro-BGA through to large area array devices. Contact us to confirm suitability for your component.

Same-Site Processing

Laser reballing completed alongside programming and taping at the same facility. One visit, multiple processes — reducing lead time and handling.

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FAQ's

Below we have answered some common questions, however if the answer you're looking for isn't here please call us on +44 (0)1604 491107 or email via our contact form.

PC, PET, PP, PS and PVC. Each is available in antistatic or dissipative versions where the component needs ESD protection. The right choice depends on pocket geometry, the sensitivity of the part and how the tape will be handled downstream.

Antistatic material resists building up a charge when tape moves against itself or against a feeder. Dissipative material goes further and allows any charge that does build up to bleed away in a controlled way rather than discharging suddenly into a component. Which one you need is driven by the ESD sensitivity class of the device.

No. Passive components and mechanical parts generally do not. Integrated circuits, discrete semiconductors, MEMS devices and anything with an exposed gate usually do. If you are unsure, the component datasheet will state an ESD sensitivity class and that is the thing to design against.

By the tape design, the cavity depth and any customer-specific requirement. A deep pocket draws material thinner as it forms, so a deeper cavity generally starts from a thicker film. This is set at design stage rather than chosen from a list.

Yes. The same thermoforming process handles small mechanical components that need presenting to an automated assembly machine in a fixed orientation. ESD grades are usually unnecessary in that case, which can reduce cost.

Send us the component and the application and we will recommend one. In practice PS and PET cover most requirements, with PC used where the pocket is deep or the part is heavy, and PVC or PP chosen for specific chemical or temperature reasons.

Systemation Euro

Other Services We Offer

Device Programming

IC programming services, complemented by dedicated device storage and handling.

SMD Taping & Reeling

Our automatic Taping & Reeling machines provide efficient, repeatable processing for our customers.

Bare Die Tape & Reel

We process CSP, WLCSP and flip chip devices from wafer, film frame and waffle pack into EIA-481-F compliant carrier tape.

Axial & Radial Taping

We tape and reel a wide range of axial and radial components including capacitors, resistors, diodes and springs.

Laser Marking

We use a concentrated beam of light to create permanent marks on the surfaces of target components.

Dry Packing

We offer a full dry packing service for all moisture-sensitive components.

OEM Project Support

Work with experienced operators who have full knowledge of the machines who can quickly have your cell operating.

Consumables Supply

In addition to the extensive services provided by Systemation Euro, we also supply a complete range of consumables.

Contact Us

Schedule a consultation with one of our specialists today to determine the perfect service solution.